The UW Institute for Neuroengineering presents: December’s UWIN seminar: Short talks by UWIN faculty Tom Daniel and Chris Rudell!
“Engineering Odor Guided Flight” – Tom Daniel, Professor, Department of Biology, University of Washington
“Highly-Integrated Neural Stimulation Electronics for Bidirectional Brain-Computed Interfaces (BBCI) including Artifact Cancellation” – Chris Rudell, Associate Professor, Department of Electrical and Computer Engineering, University of Washington
Refreshments will be served prior to the talks.
“Engineering Odor Guided Flight” (Tom Daniel):
The capacity for animals to localize odor sources far exceeds what can be manufactured today. In part, this extraordinary capacity is due to the behavioral mechanisms animals use and in part to the neural machine they deploy. This talk will review past work in odor localization and then continue to a neuro-integrated system that draws on the unparalleled sensory capabilities of animals. It is also possible I may change my mind and talk about something else.
“Highly-Integrated Neural Stimulation Electronics for Bidirectional Brain-Computed Interfaces (BBCI) including Artifact Cancellation” (Chris Rudell):
Miniaturization of neural stimulation and recording electronics is a key obstacle to the vision of using in vivo Bidirectional Brain Computer Interfaces (BBCI) for neuromodulation. This presentation will highlight techniques enabling integration of BBCI systems in single chip form. Specifically, our group has focused on integrating stimulation electronics using low-voltage digital CMOS to achieve a reliable high-voltage compliant (+/-12V) single-chip stimulator. The chip is capable of delivering a Biphasic Current Pulse of up to 2mA into a broad range of electrode impedances, from purely resistive to capacitive. The presentation will conclude with the description of a recently fabricated BBCE chip. A product of joint collaborative efforts, this 2mm x 2mm single chip integrates a 64-channel neural recording front-end with 4-stimulation channels and both differential- and common-mode artifact cancellation in a 65nm TSMC process.